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Wirebonding in Microelectronics (Set 2) Harman 3 Rev edition
Wirebonding in Microelectronics (Set 2)
Harman
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. This title covers wire bonding advances for the era of super-small electronics.
| 介质类型 | 图书 Book |
| 已发行 | 2010年2月1日 |
| ISBN13 | 9780071701013 |
| 出版商 | McGraw-Hill Education - Europe |
| 商品尺寸 | 150 × 220 × 20 mm · 500 g (预估重量) |
