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Area Array Package Design Ken Gilleo
Area Array Package Design
Ken Gilleo
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
| 介质类型 | 图书 Paperback Book (平装胶订图书) |
| 已发行 | 2003年10月24日 |
| ISBN13 | 9780071737739 |
| 出版商 | McGraw-Hill |
| 页数 | 220 |
| 商品尺寸 | 231 × 11 × 188 mm · 385 g |
| 语言 | 英语 |
