John W Balde
Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging John W Balde Softcover reprint of the original 1st ed. 2003 edition

Name: Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging
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Author: John W Balde

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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging

John W Balde

Softcover reprint of the original 1st ed. 2003 edition

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

366 pages, 266 black & white illustrations, biography

介质类型	图书 Paperback Book (平装胶订图书)
已发行	2014年2月23日
ISBN13	9781461349778
出版商	Springer-Verlag New York Inc.
页数	347
商品尺寸	155 × 235 × 20 mm · 521 g
语言	英语
编辑	Balde, John W.