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Three-Dimensional Molded Interconnect Devices (3D-Mid) Jorg Franke
Three-Dimensional Molded Interconnect Devices (3D-Mid)
Jorg Franke
Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
356 pages
| 介质类型 | 图书 Book |
| 已发行 | 2014年4月30日 |
| ISBN13 | 9781569905517 |
| 出版商 | Hanser Publications |
| 页数 | 356 |
| 商品尺寸 | 174 × 246 × 25 mm · 1 kg |
| 编辑 | Franke, Jorg |
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