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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Ehrenfried Zschech Softcover reprint of hardcover 1st ed. 2005 edition
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预计送达时间 年7月20日 - 年7月30日
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes
Ehrenfried Zschech
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
508 pages, 72 black & white tables, biography
| 介质类型 | 图书 Paperback Book (平装胶订图书) |
| 已发行 | 2010年10月22日 |
| ISBN13 | 9781849969673 |
| 出版商 | Springer London Ltd |
| 页数 | 508 |
| 商品尺寸 | 155 × 235 × 27 mm · 734 g |
| 语言 | 英语 |
| 编辑 | Mikolajick, Thomas |
| 编辑 | Whelan, Caroline |
| 编辑 | Zschech, Ehrenfried |