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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes E Zschech 2005 edition
价格
元 1.606
不含税
远程仓调货
预计送达时间 年7月10日 - 年7月28日
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes
E Zschech
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
508 pages, 72 black & white tables, biography
| 介质类型 | 图书 Hardcover Book (精装硬皮书) |
| 已发行 | 2005年9月1日 |
| ISBN13 | 9781852339418 |
| 出版商 | Springer London Ltd |
| 页数 | 508 |
| 商品尺寸 | 155 × 235 × 28 mm · 916 g |
| 语言 | 英语 |
| 编辑 | Mikolajick, Thomas |
| 编辑 | Whelan, Caroline |
| 编辑 | Zschech, Ehrenfried |