3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition

Name: 3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics

Softcover reprint of the original 1st ed. 2017 edition

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i

介质类型	图书 Paperback Book (平装胶订图书)
已发行	2018年7月13日
ISBN13	9783319830865
出版商	Springer International Publishing AG
页数	463
商品尺寸	150 × 220 × 10 mm · 662 g
语言	德语
编辑	Goyal, Deepak
编辑	Li, Yan