Materials for Advanced Packaging Softcover reprint of the original 2nd ed. 2017 edition

Name: Materials for Advanced Packaging
Price: 1509 CNY
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元 1.509

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其他版本：

Hardcover Book

2nd ed. 2017 edition

(2016) 元 2.046

Materials for Advanced Packaging

Softcover reprint of the original 2nd ed. 2017 edition

Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.

969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration

介质类型	图书 Paperback Book (平装胶订图书)
已发行	2018年6月8日
ISBN13	9783319832098
出版商	Springer International Publishing AG
页数	969
商品尺寸	234 × 157 × 55 mm · 1,49 kg
语言	德语
编辑	Lu, Daniel
编辑	Wong, C.P.