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Modeling and Application of Flexible Electronics Packaging Huang 1st ed. 2019 edition
Modeling and Application of Flexible Electronics Packaging
Huang
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.
287 pages, XVII, 287 p.
| 介质类型 | 图书 Book |
| 已发行 | 2019年5月7日 |
| ISBN13 | 9789811336263 |
| 出版商 | Springer Verlag, Singapore |
| 页数 | 287 |
| 商品尺寸 | 150 × 220 × 20 mm · 629 g |
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