3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics Second Edition 2021 edition

Name: 3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics
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Hardcover Book

Second Edition 2021 edition

(2020) 元 1.255

3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics

Second Edition 2021 edition

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

622 pages, 100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622

介质类型	图书 Paperback Book (平装胶订图书)
已发行	2021年11月24日
ISBN13	9789811570926
出版商	Springer Verlag, Singapore
页数	622
商品尺寸	150 × 220 × 10 mm · 967 g
编辑	Goyal, Deepak
编辑	Li, Yan