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Semiconductor Advanced Packaging John H. Lau 2021 edition
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元 1.101
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预计送达时间 年7月22日 - 年8月3日
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其他版本：
Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| 介质类型 | 图书 Hardcover Book (精装硬皮书) |
| 已发行 | 2021年5月18日 |
| ISBN13 | 9789811613753 |
| 出版商 | Springer Verlag, Singapore |
| 页数 | 498 |
| 商品尺寸 | 163 × 242 × 41 mm · 1,08 kg |
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