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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology Cher Ming Tan 2013 edition
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| 介质类型 | 图书 Paperback Book (平装胶订图书) |
| 已发行 | 2013年5月4日 |
| ISBN13 | 9789814451208 |
| 出版商 | Springer Verlag, Singapore |
| 页数 | 103 |
| 商品尺寸 | 155 × 235 × 6 mm · 1,88 kg |
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