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Advanced MEMS Packaging John Lau Ed edition
Advanced MEMS Packaging
John Lau
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.
576 pages, Illustrations
| 介质类型 | 图书 Hardcover Book (精装硬皮书) |
| 已发行 | 2009年12月16日 |
| ISBN13 | 9780071626231 |
| 出版商 | McGraw-Hill Education - Europe |
| 页数 | 576 |
| 商品尺寸 | 161 × 237 × 36 mm · 906 g |