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Integrated Circuit Packaging, Assembly and Interconnections William Greig Softcover reprint of hardcover 1st ed. 2007 edition
价格
元 780
不含税
远程仓调货
预计送达时间 年7月23日 - 年8月4日
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其他版本:
Integrated Circuit Packaging, Assembly and Interconnections
William Greig
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
300 pages, 75 black & white illustrations, biography
| 介质类型 | 图书 Paperback Book (平装胶订图书) |
| 已发行 | 2010年10月29日 |
| ISBN13 | 9781441939234 |
| 出版商 | Springer-Verlag New York Inc. |
| 页数 | 300 |
| 商品尺寸 | 155 × 235 × 17 mm · 458 g |
| 语言 | 英语 |