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Solder Joint Reliability Prediction for Multiple Environments Andrew E. Perkins Softcover reprint of hardcover 1st ed. 2009 edition
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元 790
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预计送达时间 年7月7日 - 年7月17日
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其他版本:
Solder Joint Reliability Prediction for Multiple Environments
Andrew E. Perkins
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
192 pages, 70 black & white illustrations, 37 black & white tables, biography
| 介质类型 | 图书 Paperback Book (平装胶订图书) |
| 已发行 | 2010年11月5日 |
| ISBN13 | 9781441946348 |
| 出版商 | Springer-Verlag New York Inc. |
| 页数 | 192 |
| 商品尺寸 | 155 × 235 × 11 mm · 299 g |
| 语言 | 英语 |