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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Jan A. Dziuban
价格
元 1.256
不含税
远程仓调货
预计送达时间 年7月16日 - 年8月3日
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其他版本:
Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics
Jan A. Dziuban
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.
334 pages, biography
| 介质类型 | 图书 Hardcover Book (精装硬皮书) |
| 已发行 | 2006年6月13日 |
| ISBN13 | 9781402045783 |
| 出版商 | Springer-Verlag New York Inc. |
| 页数 | 334 |
| 商品尺寸 | 156 × 235 × 20 mm · 771 g |
| 语言 | 英语 |